1 fn6624.1 caution: these devices are sensitive to electrosta tic discharge; follow proper ic handling procedures. 1-888-intersil or 1-888-468-3774 | intersil (and design) and xdcp are registered trademarks of intersil americas inc. copyright intersil americas inc. 2007, 2011. all rights reserved all other trademarks mentioned are the property of their respective owners. ISL22346WM quad digitally controlled potentiometers (xdcp?) low noise, low power i 2 c ? bus, 128 taps the ISL22346WMvep in tegrates four di gitally controlled potentiometers (dcp) and non-volatile memory on a monolithic cmos integrated circuit. the digitally controlled potenti ometers are implemented with a combination of resistor elements and cmos switches. the position of the wipers are contro lled by the user through the i 2 c bus interface. each potentiometer has an associated volatile wiper register (wr) and a non-volatile initial value register (ivr) that can be directly written to and read by the user. the contents of the wr controls the position of the wiper. at power-up, the device recalls the contents of the two dcp?s ivr to the corresponding wrs. the dcps can be used as a three-terminal potentiometers or as a two-terminal variable resistors in a wide variety of applications including control, parameter adjustments and signal processing. device information the specifications for an enhanced product (ep) device are defined in a vendor item drawing (vid), which is controlled by the defense logistics agency (dla). ?hot-links? to the applicable vid and other supporting application information are provided on our website. pinout features ? specifications per dscc vid v62/08605-01xe ? full mil-temp electrical perf ormance from -55c to +125c ? controlled baseline with one wafer fabrication site and one assembly/test site ? full homogeneous lot processing in wafer fab ? no combination of wafer fabrication lots in assembly ? full traceability through assembly and test by date/trace code assignment ? enhanced process change notification ? enhanced obsolescence management ? eliminates need for up-screening a cots component ? four potentiometers in one package ? 128 resistor taps ?i 2 c serial interface - three address pins, up to eight devices/bus ? non-volatile storage of wiper position ? wiper resistance: 70 typical @ 3.3v ? shutdown mode ? shutdown current 5a max ? power supply: 2.7v to 5.5v ?10k total resistance ? high reliability - endurance: 1,000,000 data changes per bit per register - register data retention: - 10 years @ t +125c - 15 years @ t +90c - 50 years @ t +55c ? 20 ld tssop ISL22346WMvep (20 ld tssop) top view rw0 rl0 rh0 shdn vcc a1 a0 rh1 rl1 rw1 20 19 18 17 16 15 14 13 12 11 1 2 3 4 5 6 7 8 9 10 rh3 rl3 rw3 a2 scl sda gnd rw2 rl2 rh2 ordering information vendor part number (notes 1, 2) vendor item drawing part marking resistance option (k ) temp. range (c) package pkg. dwg. # ISL22346WMvep v62/08605-01xe 22346 wmvep 10 -55 to +125 20 ld tssop m20.173 notes: 1. add ?-tk? suffix for tape and reel. please refer to tb347 for details on reel specifications. 2. devices must be procured to the vendor part number. data sheet november 11, 2011
2 fn6624.1 november 11, 2011 block diagram i 2 c interface v cc rh0 rh1 rh2 rh3 gnd rl0 rl1 rl2 rl3 rw0 rw1 rw2 rw3 scl sda a0 a1 a2 wr3 wr2 wr1 wr0 shdn power-up interface, control and status logic non- volatile registers pin descriptions tssop pin symbol description 1 rh3 ?high? terminal of dcp3 2 rl3 ?low? terminal of dcp3 3 rw3 ?wiper? terminal of dcp3 4 a2 device address input for the i 2 c interface 5 scl open drain i 2 c interface clock input 6 sda open drain serial data i/o for the i 2 c interface 7 gnd device ground pin 8 rw2 ?wiper? terminal of dcp2 9 rl2 ?low? terminal of dcp2 10 rh2 ?high? terminal of dcp2 11 rw1 ?wiper? terminal of dcp1 12 rl1 ?low? terminal of dcp1 13 rh1 ?high? terminal of dcp1 14 a0 device address input for the i 2 c interface 15 a1 device address input for the i 2 c interface 16 vcc power supply pin 17 shdn shutdown active low input 18 rh0 ?high? terminal of dcp0 19 rl0 ?low? terminal of dcp0 20 rw0 ?wiper? terminal of dcp0 ISL22346WM
3 all intersil u.s. products are manufactured, asse mbled and tested utilizing iso9000 quality systems. intersil corporation?s quality certifications ca n be viewed at www.intersil.com/design/quality intersil products are sold by description only. intersil corpor ation reserves the right to make changes in circuit design, soft ware and/or specifications at any time without notice. accordingly, the reader is cautioned to verify that data sheets are current before placing orders. information furnishe d by intersil is believed to be accurate and reliable. however, no responsibility is assumed by intersil or its subsidiaries for its use; nor for any infringements of paten ts or other rights of third parties which may result from its use. no license is granted by implication or otherwise under any patent or patent rights of intersil or its subsidiari es. for information regarding intersil corporation and its products, see www.intersil.com fn6624.1 november 11, 2011 ISL22346WM thin shrink small outlin e plastic packages (tssop) index area e1 d n 123 -b- 0.10(0.004) c a m bs e -a- b m -c- a1 a seating plane 0.10(0.004) c e 0.25(0.010) b m m l 0.25 0.010 gauge plane a2 notes: 1. these package dimensions are wi thin allowable dimensions of jedec mo-153-ac, issue e. 2. dimensioning and tolerancing per ansi y14.5m - 1982. 3. dimension ?d? does not include mold flash, protrusions or gate burrs. mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. dimension ?e1? does not include in terlead flash or protrusions. inter- lead flash and protrusions shall not exceed 0.15mm (0.006 inch) per side. 5. the chamfer on the body is optional. if it is not present, a visual index feature must be located within the crosshatched area. 6. ?l? is the length of terminal for soldering to a substrate. 7. ?n? is the number of terminal positions. 8. terminal numbers are shown for reference only. 9. dimension ?b? does not include dam bar protrusion. allowable dambar protrusion shall be 0.08mm (0.003 inch) total in excess of ?b? dimen- sion at maximum material conditi on. minimum space between protru- sion and adjacent lead is 0.07mm (0.0027 inch). 10. controlling dimension: millimete r. converted inch dimensions are not necessarily exact. (angles in degrees) 0.05(0.002) m20.173 20 lead thin shrink small outline plastic package symbol inches millimeters notes min max min max a - 0.047 - 1.20 - a1 0.002 0.006 0.05 0.15 - a2 0.031 0.051 0.80 1.05 - b 0.0075 0.0118 0.19 0.30 9 c 0.0035 0.0079 0.09 0.20 - d 0.252 0.260 6.40 6.60 3 e1 0.169 0.177 4.30 4.50 4 e 0.026 bsc 0.65 bsc - e 0.246 0.256 6.25 6.50 - l 0.0177 0.0295 0.45 0.75 6 n20 207 0 o 8 o 0 o 8 o - rev. 1 6/98
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